JOHNAN provides consistent services for 3D mounting, from product development and prototyping to mass production, in any business field. We help clients solve their challenges, such as design, miniaturization and weight reduction of products. We are here to meet a wide variety of needs of monozukuri (manufacturing).
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For details, check “Information Download and Inquiries” below.
3D mounting is a generic term for technologies that enable the mounting of electronic components, not only on flat surfaces but also on three-dimensional locations and structures. It is expected that these technologies substantially enhance the potential of monozukuri (manufacturing). JOHNAN is promoting a full-fledged 3D mounting business, including 3D-MID mounting.
MID is an abbreviation for Mechatronics Integrated Device. It is an injection molded component, on which an electric circuit, electrodes, and conductor patterns are directly applied. 3D-MID mounting is a part of 3D surface-mount technologies.
Conventionally, a planar substrate on which electronic components are mounted is attached to the housing of electronic equipment. Meanwhile, 3D mounting enables such components to be directly mounted on the housing to produce a high-performance package.
An electrical circuit and wiring are directly applied onto the housing to realize a space-saving, high-performance product.
3D mounting enables the mounting of electronic components through the application of a circuit directly onto the three-dimensional surfaces of products. This enhances the effective use of the surface portion of products, realizing smaller and lighter products than when a planar substrate is used.
3D mounting allows the mounting of electronic components through the application of a circuit directly onto the housing, based on the respective shapes of clients’ products. In comparison with the conventional method using a planar substrate, this technology allows higher design flexibility in product structure to realize enhanced designability of products.
3D mounting allows the direct mounting of components onto the product housing. This eliminates substrates and reduces the number of components, thereby decreasing assembly man-hours, and helps improve the work efficiency at production sites.
PCB mounting (2D)
Structure with planar substrates attached to the housing.
Direct mounting is feasible on the surface of three-dimensional molded products.
Reflow soldering cannot be performed on products with low heat-resistance. JOHNAN is capable of mounting components onto such products.Information available to download regarding the mounting method applicable to products with low heat resistance.
JOHNAN provides a wide variety of services, from product development and prototyping to mass manufacturing, for any industries and businesses.
JOHNAN meets various requirements of clients, from specification design and production of three-dimensional products, to metal plating and 3D mounting.。
Developed products, prototypes, mass-production prototypes, mass-produced products
|Type||3D circuit carrier (MID)||2D circuit carrier|
|Chip Size (mm)||Min. 0402||Min. 0201|
|Work Height (mm)||~ 8
8 ~ 28
|Work Size (mm)||Max. L42 x W70 (H=1～8)
Max. L42 x W54 (H=8～28)
|Max. L1,240 x W510|
|Placement Accuracy (μm)||±40||±40|
|Pitch Width (μm)||±80||±80|
* For more detailed information, please contact us!
In December 2017, JOHNAN introduced a new 3D Hybrid Modular System (YAMAHA’s S20) and started 3D surface-mount service as a new service. Working closely with an MID manufacturer (Sankyo Kasei), we offer best possible 3D-MID solutions for our clients to address individual specific requirements.
JOHNAN provides a one-stop solution from product development and prototyping to mass-production prototyping and mass production of 3D products. Check the details of our services below. Please contact us regarding any questions or requests.
We propose the optimal production method by carefully examining the requests of clients.
* We provide some of our services in cooperation with our partners.
For many years, JOHNAN has offered EMS, electronics manufacturing services. In particular, we have offered PCB mounting service for clients in many industrial fields, including switch panels for marine vessels that require high reliability. Now, we have established a production system from prototyping to mass production using Japan’s first 3D-MID surface mounter to respond to a wide variety of products in different fields.
There were many technical challenges to overcome to realize the automation of 3D mounting, which had long been awaited. JOHNAN will accelerate efforts to expand its 3D mounting business using its 2D mounting technologies and expertise accumulated over about twenty years.
Technologies and expertise of PCB mounting (2D)
We participated in the JPCA Show 2018 (48th International Electronic Circuits Exhibition) hosted by the Japan Electronics Packaging and Circuits Association (JPCA), and held from June 6 (Wed.) to 8 (Fri.), 2018. Representing our company, Oka and Nozaki gave a presentation at the 3D-MD Pavilion Seminar, attended by many visitors.