3D Surface-Mount Technology

Nation’s first! A platform from prototyping to mass manufacturing with 3D-MID surface mounter in Japan.

JOHNAN provides consistent services for 3D mounting, from product development and prototyping to mass production, in any business field. We help clients solve their challenges, such as design, miniaturization and weight reduction of products. We are here to meet a wide variety of needs of monozukuri (manufacturing).
Click here for 3D Surface-Mount Technology movie.
For details, check “Information Download and Inquiries” below.

1. What is 3D mounting?

3D mounting is a generic term for technologies that enable the mounting of electronic components, not only on flat surfaces but also on three-dimensional locations and structures. It is expected that these technologies substantially enhance the potential of monozukuri (manufacturing). JOHNAN is promoting a full-fledged 3D mounting business, including 3D-MID mounting.

MID is an abbreviation for Mechatronics Integrated Device. It is an injection molded component, on which an electric circuit, electrodes, and conductor patterns are directly applied. 3D-MID mounting is a part of 3D surface-mount technologies.

Key benefits of 3D mounting technologies

  • (1) Advanced performance of products
  • (2) Smaller, thinner and lighter products
  • (3) Enhanced designability of products
  • (4) Improved work efficiency in production
  • (5) Application to products with low heat resistance

(1) Advanced performance of products

Conventionally, a planar substrate on which electronic components are mounted is attached to the housing of electronic equipment. Meanwhile, 3D mounting enables such components to be directly mounted on the housing to produce a high-performance package.

■Helicopters manufactured with 3D mounting technologies

An electrical circuit and wiring are directly applied onto the housing to realize a space-saving, high-performance product.

Enhanced designability of products  (Example) On-vehicle antenna Enhanced designability of products  (Example) On-vehicle antenna

(2) Smaller, thinner and lighter products

3D mounting enables the mounting of electronic components through the application of a circuit directly onto the three-dimensional surfaces of products. This enhances the effective use of the surface portion of products, realizing smaller and lighter products than when a planar substrate is used.

(3) Enhanced designability of products

3D mounting allows the mounting of electronic components through the application of a circuit directly onto the housing, based on the respective shapes of clients’ products. In comparison with the conventional method using a planar substrate, this technology allows higher design flexibility in product structure to realize enhanced designability of products.

■Enhanced designability of products (Example) On-vehicle antenna
Enhanced designability of products  (Example) On-vehicle antenna Enhanced designability of products  (Example) On-vehicle antenna

(4) Improved work efficiency in production

3D mounting allows the direct mounting of components onto the product housing. This eliminates substrates and reduces the number of components, thereby decreasing assembly man-hours, and helps improve the work efficiency at production sites.

■ Improved work efficiency in production (Example) Product assembly

PCB mounting (2D)

PCB mounting (2D)

Structure with planar substrates attached to the housing.

3D mounting

3D mounting 3D mounting

Direct mounting is feasible on the surface of three-dimensional molded products.

(5) Application to products with low heat resistance

Reflow soldering cannot be performed on products with low heat-resistance. JOHNAN is capable of mounting components onto such products.

Information available to download regarding the mounting method applicable to products with low heat resistance.
Click here to see the details.
Application to products with low heat resistance

2. JOHNAN’s unique features and strengths

The unique features and strength of JOHNAN’s 3D mounting are as follows:

  • (1) Possible to mount on up to five surfaces on mass-produced products
  • (2) Possible to mount micro-sized devices (0402)
  • (3) Possible to mount on curved surfaces
Information available to download regarding the unique features and strengths of JOHNAN’s 3D mounting
Click here to see the details.

3. Service scope

JOHNAN provides a wide variety of services, from product development and prototyping to mass manufacturing, for any industries and businesses.

(1) Service scope

JOHNAN meets various requirements of clients, from specification design and production of three-dimensional products, to metal plating and 3D mounting.。

Service Scope and Applications

(2) Products covered by our services

Developed products, prototypes, mass-production prototypes, mass-produced products

(3) Specification:

Type 3D circuit carrier (MID) 2D circuit carrier
Chip Size (mm) Min. 0402 Min. 0201
Work Height (mm) ~ 8
8 ~ 28
-
Work Size (mm) Max. L42 x W70 (H=1~8)
Max. L42 x W54 (H=8~28)
Max. L1,240 x W510
Placement Accuracy (μm) ±40 ±40
Pitch Width (μm) ±80 ±80

* For more detailed information, please contact us!

(4) Introduced a new 3D Hybrid Modular System

In December 2017, JOHNAN introduced a new 3D Hybrid Modular System (YAMAHA’s S20) and started 3D surface-mount service as a new service. Working closely with an MID manufacturer (Sankyo Kasei), we offer best possible 3D-MID solutions for our clients to address individual specific requirements.

YAMAHA

(5) 3D Surface-Mount Technology movie

4.Establishing a platform for 3D products

JOHNAN provides a one-stop solution from product development and prototyping to mass-production prototyping and mass production of 3D products. Check the details of our services below. Please contact us regarding any questions or requests.

  • ① Three-dimensional product development
    (We provide consistent services including planning, specification designing, producing drawings, molding and 3D mounting.)
  • ② Product development / prototyping
  • ③ Mass-production prototyping / mass production
  • ④ From product development / prototyping to mass-production prototyping / mass production

We propose the optimal production method by carefully examining the requests of clients.

3D-MID Platform with Partners 3D-MID Platform with Partners

* We provide some of our services in cooperation with our partners.

5.Challenges to 3D Mounting—as an SME providing EMS (Electronics Manufacturing Services)—

Nation’s first! A platform from prototyping to mass manufacturing with 3D-MID surface mounter in Japan

For many years, JOHNAN has offered EMS, electronics manufacturing services. In particular, we have offered PCB mounting service for clients in many industrial fields, including switch panels for marine vessels that require high reliability. Now, we have established a production system from prototyping to mass production using Japan’s first 3D-MID surface mounter to respond to a wide variety of products in different fields.

There were many technical challenges to overcome to realize the automation of 3D mounting, which had long been awaited. JOHNAN will accelerate efforts to expand its 3D mounting business using its 2D mounting technologies and expertise accumulated over about twenty years.

Technologies and expertise of PCB mounting (2D)

Technologies and expertise of PCB mounting (2D)

6.Topics

JPCA Show 2018 (48th International Electronic Circuits Exhibition)

We participated in the JPCA Show 2018 (48th International Electronic Circuits Exhibition) hosted by the Japan Electronics Packaging and Circuits Association (JPCA), and held from June 6 (Wed.) to 8 (Fri.), 2018. Representing our company, Oka and Nozaki gave a presentation at the 3D-MD Pavilion Seminar, attended by many visitors.

Event schedule
  • ■ Participated in JPCA Show 2018 (The 48th International Electronic Circuits Exhibition) (June 6 to 8, 2018)
  • ■ Participated as a member of Kyoto Shisaku Net at the 21st Mechanical Components & Materials Technology EXPO Osaka (M-Tech) (Oct. 3 to 5, 2018)
  • ■ Participated as a member of Kyoto Shisaku Net at Monozukuri Fair 2018 (Oct. 17 to 19, 2018)
  • ■ Planning to participate in ICMD Autumn 2018 (The 27th International Component Manufacturing & Design Show) (Shenzhen, China) (Oct. 28 to 30, 2018)
  • ■ Planning to give a lecture at the 16th Annual Lecture Meeting in FY2018 held by Japan MID Association (Nov. 1, 2018)
  • ■ Planning to participate in the 48th INTERNEPCON JAPAN 2019—Trade fair for manufacturing technologies for the production of electronic products— (Jan. 16 to 18, 2019)
  • ■ Planning to participate as a member of Kyoto Shisaku Net in MD&M 2019 (Anaheim, California, U.S.) (Feb. 5 to 7, 2019)

7. Information Download and Inquiries

Contact us if you want to know more about 3D mounting or if you are interested in our services.

■ Information Download
Download our brochure about 3D Surface-Mount technology

For those interested in the features and applications of 3D mounting, easy-to-understand information is available.