Events

Research & Development

As a leading provider of 3D MID technology, JOHNAN actively participates in various activities in its practice of society.

1. Shows

We have participated in various shows and fairs in Japan, see below.

JPCA Show 2019

JPCA Show 2019
(49th International Electronic Equipment Total Solution Show)

Business Exchange Fair 2019

Business Exchange Fair 2019

The 47th Internepcon Japan

The 47th Internepcon Japan
Electronics Manufacturing and Mounting Technology Exhibition

2. Lectures & Seminars

We have been presenting at 3D MID related seminars, here are some examples

JPCA Show 2019 3D-MID Pavilion Seminar

JPCA Show 2019
3D-MID Pavilion Seminar

June 2019 Power Semiconductor Study Group Public interest incorporated foundation Okayama Industrial Promotion Foundation

June 2019 Power Semiconductor Study Group
Public interest incorporated foundation Okayama Industrial Promotion Foundation

JPCA Show 2018 3D-MID Pavilion Seminar

JPCA Show 2018
3D-MID Pavilion Seminar

3. Press & articles

Our 3D MID technology was published in magazines and articles.

Press & Articles

(source: Plastics News Europe)

An article about our company was published in Plastics News Europe (JANUARY / FEBRUARY ISSUE 2019, p.28-30.) at the 3D-MID Molded Interconnect Device Congress held in Germany in September 2018.

4.Research & Development

We are actively using MID new technology for various product development, please contact us for more information.
(e.g.) MID feedthrough connector