JOHNAN participated in "JPCA Show 2017", organized by Japan Electronics Packaging and Circuits Association (JPCA), along with Sankyo Kasei Co., Ltd., who exhibited 3D-MID (Molded Interconnect Device) for the event.
Sankyo Kasei Co., Ltd. has developed MID manufacturing process called "SKW" and succeeded the first mass manufacturing of MID in Japan. They have extensive experience in a wide range of fields including automotive sensors, antennas, and optical pick-up. They currently own five 3D-MID processes in accordance with the product structure and applications. We handled 3D assembly on their 3D-MID using our mounting technology.
We are constantly providing solutions through our challenges and new technology development, in order to respond to the diversified needs of component mounting, including the Japan's first 3D assembly technology.
Event Hours: Wednesday-Friday, June 7-9: 10:00-17:00
Venue: Tokyo Big Sight East Hall 4-8:
Event Website: JPCA Show 2017 (http://www.jpcashow.com/show2017/en/)
Related Site: Sankyo Kasei Co., Ltd. (http://www.sankyou.jp/index.htm) (Japanese)