We would like to thank you for spending your time visiting Sankyo Kasei and JOHNAN's booth at Internepcon Japan 2018, the largest exhibition for electronics R&D and manufacturing technology in Asia organized by Reed Exhibitions Japan held in Tokyo Big Sight, Japan, from January 16 to 18.
The show concluded with a great success and we were impressed by the number of visitors and the interests in our 3D-MID solutions.

Feel free to contact us if you have further inquiries or in case you need more information about our 3D-MID and 3D surface-mount services.

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  Our 3D-MID product sample showcased at YAMAHA’s booth

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  Product showcased at our booth

Co-exhibitor: Sankyo Kasei Co., Ltd.(Japanese)

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