0201(mm) MLCC Capacitor Embedded Substrate.
Smartphone 5G expansion, electrical parts form factor and microelectronics packaging will be more advanced and demanded. Furthermore, Hi-speed broadband data transmission requires EMC countermeasure technologies.
According to the demand, JOHNAN Corporation and Tai-Hong Circuit Industry (Taiwan) co-developed Component Embedded Substrate (PCB) associated with 008004(inch), 0201(mm) Size Multilayer Ceramic Capacitor with a Capacitance Value of 0.1 μF, another world's first.
The world's first 0.1µF in 008004(inch), 0201(mm) size capacitor embedded substrate technology. Substrate base material (CCL) is BT resin, which is lower transmission loss (tangent delta) and excellent wire bonding ability.
It contributes for EMC solution of 5G or more and hi-speed broadband digital transmission.
Introduce video clip.
「0201(mm) MLCC Capacitor」Do you face any issues as below？
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Hi-speed board-band transmission interface, unstable voltage between Power Supply and Ground.
As a result, EMC gets worse and the system functions unstable.
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Minimize decoupling capacitor ESL even smaller and make the impedance lower.
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For EMC noise countermeasures, it needs to add more decoupling capacitors, however, no room to place on surface.
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For EMC noise countermeasures, add on more decoupling capacitors, however, the trace gets longer and the lower effectiveness.
0201 Capacitor Embedded Substrate solves your product form factor and improve your signal/power integrity.
Stabilize voltage between power supply and ground at hi-speed board-band transmission.
Minimize ESL of decoupling capacitor and lower impedance.
Save your space and form factor.
1. Features.
●More flexible design than conventional component embedded substrate.
125um height of 0201 components makes embedded in thin prepreg easier.
●To compared with high Dk CCL, more flexibility to select capacitance constant variation.
Gradually, 0201 MLCC variations are more available from several top suppliers, you can design the constant and optimize it.
●Locate capacitors optimized at less ESL trace.
Enable to place 0201 capacitors between power and ground plane at right underneath of bare chip.
●Enable to place 0201 chips with min. 0.1mm gaps next to adjacent parts.
It may need to evaluate in each case.
2. Services that we provide.
Introduce JOHNAN's service on this technology. Please feel free to inquire.
・Sell 0201 embedded PCB and Semiconductor substrate.
・Mount 0201 components on 400x 500mm L-sized working panel.
・Manufacture LGA/CSP package assembly on 0201 capacitors embedded substrate.
・Provide package design service and PCB design of 0201 capacitors embedded substrate.